According to the complete ranking of the 20 best AIoT chips in China released by China’s authoritative Internet of Things portal, the following 10 chips have outstanding performance in technical performance, market application and ecological layout, and can be regarded as benchmark products in the AIoT field.

Based on the latest industry trends and corporate competitiveness analysis in 2025, the 10 best AIoT chips in China are recommended:

1. Rockchip RK3588

Rockchip RK3588 iot chips

Rockchip RK3588 iot chips

  • Technical parameters: 8nm process, 6TOPS NPU computing power, support for 8K video encoding and decoding, integrated dual-band Wi-Fi 6 and Bluetooth 5.0.
  • Application scenarios: smart cockpit (BYD Yangwang series), industrial robots, security monitoring (NVR market share exceeds 60%), Hongmeng robots (market share exceeds 80%).
  • Advantages: industrial-grade stability (failure rate <0.3%), support for the “one chip seven screens” function, and the target of increasing the proportion of automotive electronics revenue to 25% in 2025.

2. Huawei Ascend 910B

Huawei Ascend 910B

  • Technical parameters: FP16 computing power 280TFLOPS, INT8 computing power 140TOPS, support for multi-task parallelism.
  • Application scenarios: large model reasoning in government affairs, finance, medical care, edge computing and other fields (such as government all-in-one machines, financial full-stack solutions).
  • Advantages: The only AI chip in China that can match NVIDIA, supports dynamic voltage and frequency adjustment, and reduces power consumption to 250W.

3. Hengxuan Technology BES2800

  • Technical parameters: 6nm process, self-developed NPU architecture (computing power increased by 30%, power consumption reduced by 25%), supports active noise reduction (-42dB depth).
  • Application scenarios: TWS headphones (first in the Android camp market share), smart watches, AI glasses (cooperation with ByteDance).
  • Advantages: The world’s leading 6nm process mass production capability, mass production of SoCs with integrated Wi-Fi/ISP in 2025.

4. Espressif Technology ESP32-S3

Espressif Technology ESP32-S3

Espressif Technology ESP32-S3

  • Technical parameters: Dual-core 32-bit MCU, integrated Wi-Fi 6 and Bluetooth 5.0, supports AI voice wake-up.
  • Application scenarios: AI companion toys, smart homes, industrial Internet of Things.
  • Advantages: Wi-Fi/Bluetooth dual-mode chips have a global market share of over 30%, providing an integrated solution of “connection + processing”.

5. Jingchen Shares S905X5（Amlogic）

  • Technical parameters: 6nm process, integrated self-developed NPU (computing power 16TOPS), supports 8K decoding and AV1 encoding.
  • Application scenarios: Smart set-top boxes (domestic market share over 60%), smart TVs, automotive electronics (BMW, Lincoln supply chain).
  • Advantages: The first echelon of global multimedia SoCs, and has been at the forefront of global shipments for many consecutive years.

6. Allwinner Technology A527

  • Technical parameters: octa-core SoC, 2.0TOPS NPU computing power, support for Android 13 and Wi-Fi 6.
  • Application scenarios: GMS tablets, laptops, smart cash registers, advertising machines.
  • Advantages: High cost performance, support for multi-channel video output and input, rich interfaces.

7. Telink Semiconductor TL751X

Telink Semiconductor TL751X

Telink Semiconductor TL751X

  • Technical parameters: multi-core design (CPU+NPU+DSP), support for BLE 6.0 and Matter protocols, and the lowest power consumption in the world.
  • Application scenarios: smart wearables, smart homes, wireless audio (multi-person Mesh audio networking).
  • Advantages: The first chip in China to pass BLE 6.0 certification, with end-side AI chip sales reaching tens of millions of yuan in the first half of 2025.

8. IntelliFusion Edge10V

  • Technical parameters: 12TOPS computing power, support for dual display and peripheral expansion, built-in domestic RISC-V core.
  • Application scenarios: AI glasses, smart security, industrial vision.
  • Advantages: Pure domestic technology, support for edge CV large model inference deployment.

9. Zhongke Bluexun BT895X

  • Technical parameters: Support for Doubao large model, integrated Bluetooth 5.3 and low power design.
  • Application scenarios: TWS headphones (with FIIL brand), smart speakers.
  • Advantages: Started in the white-label market, in-depth cooperation with Volcano Engine in 2024.

10. ASR8601

  • Technical parameters: 5G baseband and RF single chip integration, support for full-standard cellular communications.
  • Application scenarios: Smart phones (breaking Qualcomm monopoly in Latin American market), IoT devices.
  • Advantages: Cat.1 chips have a global market share of nearly 50%, and RedCap technology leads the industry.

Industry trends and additional explanations

  1. Technical direction: AIoT chips are evolving towards “low power consumption + high computing power + multi-protocol integration”. For example, Rockchip RK3688 (launched in 2026) will double its computing power to 16TOPS.
  2. Market structure: Huawei, Rockchip, and Hengxuan Technology dominate the high-end market, while Espressif and Allwinner Technology perform strongly in the mid- and low-end markets.
  3. Ecosystem layout: Huawei relies on the Hongmeng ecosystem to build a “chip + OS + cloud” closed loop, and Rockchip strengthens customer stickiness through a 500,000 developer community.

For a complete list of 20 AI IoT chips, please contact us.

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